The Fan-Out Packaging (FOP) market is booming, projected to reach $2.94B by 2025 with a 16.50% CAGR. This in-depth analysis explores market drivers, trends, restraints, and key players like Samsung Electro-Mechanics and ASE Technology, covering segments like Core FOP, High-Density FOP, and Ultra High-Density FOP across various regions. Discover future growth opportunities in this dynamic sector.
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